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Thermal Management Solution

CVD Diamond for High-Performance Thermal Management

CVD diamond thermal management solutions help improve heat spreading and thermal control for demanding GaN, RF, laser, power electronics, and semiconductor applications. Single crystal and polycrystalline CVD diamond materials are available for projects requiring high thermal conductivity, electrical insulation, precision surfaces, and application-specific geometry.

Material selection should be based on the complete project requirement, including thermal performance, dimensions, thickness, surface condition, electrical requirements and integration method.
Thermal Challenge

Move Heat Away from the Device More Efficiently

CVD diamond can be positioned within the thermal path between a high-power device and the downstream cooling structure. Material type, dimensions, thickness, surface quality and interface design should be reviewed together.

01

Heat Source

Identify the device, heat-generating area and operating conditions.

02

Diamond Layer

Select single crystal or polycrystalline CVD diamond based on thermal performance and available size.

03

Thermal Interface

Review flatness, surface roughness, metallization and bonding requirements.

04

Heat Rejection

Integrate the diamond component with the downstream thermal structure.

Conceptual illustration of CVD diamond heat spreading from semiconductor device to heat sink
Conceptual Thermal Path Illustration showing heat transfer from a semiconductor device through a CVD diamond heat-spreading layer toward the cooling structure.
Material Routes

Three Ways to Start a Thermal Project

Application Product

CVD Diamond Heat Spreaders

Heat spreader projects can use either single crystal or polycrystalline CVD diamond, depending on performance, size and integration needs.

Material Route Single Crystal / Polycrystalline
Review Items Thermal grade, size, thickness, surface, metallization
View Heat Spreaders
Higher Performance

Single Crystal CVD Diamond

Higher thermal performance, higher electrical resistivity and precision surface capability.

Thermal Conductivity ≥1600 / ≥1800 / ≥2000 / ≥2200 W/(m·K)
Thickness 0.05–5.50 mm
View Single Crystal
Larger Area

Polycrystalline CVD Diamond

Larger available size combined with high thermal performance and strong cost-performance.

Thermal Conductivity ≥1000 / ≥1500 / >1800 W/(m·K)
Maximum Size Up to 8 inches
View Polycrystalline
Material Comparison

Thermal Material Reference

Core reference values used throughout JingChuang CVD thermal-management pages.

Parameter Polycrystalline CVD Diamond Single Crystal CVD Diamond
Thermal Conductivity ≥1000 / ≥1500 / >1800 W/(m·K) @ 293 K ≥1600 / ≥1800 / ≥2000 / ≥2200 W/(m·K) @ 293 K

High-end reference: 2400–2600 W/(m·K)
Thermal Diffusivity >5.5 / ≥8.3 / ≥10.0 cm²/s @ 300 K ≥10.0 / ≥11.0 / ≥12.0 cm²/s @ 300 K
Thermal Expansion 1.0 ± 0.1 ppm/K @ 300 K 1.0 ± 0.1 ppm/K @ 300 K
Volume Resistivity ≥1×10¹² Ω·cm ≥1×10¹³ Ω·cm
Thickness 0.10–1.00 mm 0.05–5.50 mm
Available Size Large-size mass production; up to 8 inches Mainstream 10×10 mm; high-end customization up to 20×20 mm
Polished Surface Roughness Ra ≤20 / 50 nm Ra ≤5 / 10 / 20 nm
Ultra-precision: 0.5–1 nm
Flatness ≤1 μm over 10 mm ≤1 μm over 10 mm
Precision reference: 0.5 μm / 10 mm
Reference values are based on standard room-temperature mass-production parameters. Final project specifications should be confirmed during technical review.
Applications

Thermal Management Across High-Performance Systems

CVD diamond material selection depends on thermal load, available size, interface conditions, surface requirements and system integration.

01

GaN / RF

CVD diamond materials can be reviewed for high-frequency thermal-management projects.

02

High-Power Laser

Single crystal diamond is a natural starting point where higher thermal performance and surface precision matter.

03

Power Electronics

Diamond thermal materials can be reviewed around device geometry, insulation and thermal-transfer requirements.

04

Semiconductor Thermal Management

Single crystal and polycrystalline options can be selected according to required size and thermal performance.

Solution Path

From Heat Source to Diamond Material Specification

STEP 01

Define the Application

Identify the device, thermal source and operating environment.

STEP 02

Select Material Route

Compare single crystal, polycrystalline or a finished heat spreader configuration.

STEP 03

Define Geometry

Confirm size, thickness, tolerance, flatness and surface finish.

STEP 04

Confirm Integration

Review metallization, bonding and quality documentation.

Integration Options

Surface, Flatness & Metallization Matter

01

Surface Finish

Single crystal and polycrystalline materials have different polished and lapped surface capabilities.

02

Flatness & Thickness

Thickness and flatness should be selected around the actual interface and geometry requirement.

03

Metallization

Reference options include Ti/Pt/Au, Ti/Au, W and Mo, with TiW/Au also listed for single crystal material.

Technical Review

What to Send for a Thermal Management Review

Send the complete system requirement rather than only asking for the highest thermal conductivity grade.

✓
Application GaN/RF, laser, power electronics, semiconductor or other application.
✓
Dimensions & Thickness Provide the target geometry and dimensional requirements.
✓
Thermal Requirement Provide target thermal conductivity or system-level requirement.
✓
Surface Requirement Define roughness, flatness and surface state.
✓
Drawing & Interface Upload drawings and metallization or bonding requirements.

Thermal Project Review

01

Submit Requirements

Application, dimensions, thermal requirement and drawing.

02

Material Review

Compare single crystal, polycrystalline and heat spreader routes.

03

Specification Review

Confirm size, thickness, surface and integration requirements.

04

Quotation

Quotation follows the confirmed technical specification.

Request a Technical Review
Quality Documentation

Material Documentation & Testing Support

CoA & Documentation

CoA documentation is available for CVD diamond materials.

  • Certificate of Analysis
  • Project-specific documentation
  • Inspection requirements reviewed during technical review

Testing Support

Testing can be aligned with confirmed project requirements.

  • Raman spectroscopy
  • Thermal performance
  • Flatness
  • Surface roughness
  • Electrical resistivity
FAQ

CVD Diamond Thermal Management Questions

What thermal conductivity grades are available?

Polycrystalline reference grades are ≥1000, ≥1500 and >1800 W/(m·K) at 293 K. Single crystal reference grades are ≥1600, ≥1800, ≥2000 and ≥2200 W/(m·K), with high-end reference values of 2400–2600 W/(m·K).

Which material should I use for the highest thermal performance?

Single crystal CVD diamond provides the higher reference thermal-performance range. Final selection should still consider available size, thickness, surface and integration requirements.

Which material is better for larger components?

Polycrystalline CVD diamond has the larger available-size advantage, with the reference specification supporting sizes up to 8 inches.

Can the material be metallized?

Yes. Reference options include Ti/Pt/Au, Ti/Au, W and Mo. TiW/Au is also listed for single crystal material.

Can I submit a complete thermal drawing for review?

Yes. Submit your application, dimensions, thickness, thermal requirement, surface condition, quantity and drawing through the RFQ form.

Is testing documentation available?

CoA documentation is available and testing can be supported according to confirmed project requirements.

Technical Review

Have a Thermal Management Requirement?

Send your application, dimensions, thickness, thermal target, surface requirement and drawing. JingChuang CVD can review the appropriate material route before quotation.