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Thermal Management

CVD Diamond Heat Spreaders for High-Performance Thermal Management

Single crystal and polycrystalline CVD diamond material options for thermal-management projects, with material grade, dimensions, thickness, surface condition and metallization reviewed according to application requirements.

Heat spreader specifications are based on the underlying single crystal and polycrystalline CVD diamond material parameters. Final project specifications are confirmed during technical review.
Product Overview

Select the Diamond Material Around the Thermal Requirement

CVD diamond heat spreaders can be based on either single crystal or polycrystalline CVD diamond. Material selection depends on thermal performance, available size, thickness, surface requirements and project geometry.

01

Thermal Grade

Select the material grade according to required thermal conductivity.

02

Size & Thickness

Single crystal and polycrystalline materials have different available size and thickness ranges.

03

Surface Condition

Polished and lapped surface options are selected according to project needs.

04

Metallization

Metallization can be reviewed according to bonding and integration requirements.

Conceptual illustration of CVD diamond heat spreader integrated between a semiconductor device and cooling structure
CVD Diamond Heat Spreader Integration Conceptual illustration showing a CVD diamond heat-spreading layer integrated between a semiconductor device and the cooling structure.
Material Selection

Single Crystal or Polycrystalline?

Both material routes can be used in thermal-management projects, but their thermal performance, size availability and precision surface capability differ.

Higher Performance

Single Crystal CVD Diamond

Single crystal CVD diamond has no grain boundaries, provides higher thermal performance and supports precision surface finishing.

Thermal Conductivity ≥1600 / ≥1800 / ≥2000 / ≥2200 W/(m·K)
High-End Reference 2400–2600 W/(m·K)
Thickness 0.05–5.50 mm
Size 10×10 mm mainstream
View Single Crystal
Larger Area

Polycrystalline CVD Diamond

Polycrystalline CVD diamond supports larger available dimensions and provides a strong balance of thermal performance and size.

Thermal Conductivity ≥1000 / ≥1500 / >1800 W/(m·K)
Maximum Size Up to 8 inches
Thickness 0.10–1.00 mm
Advantage Large-area availability
View Polycrystalline
Technical Reference

Heat Spreader Material Comparison

Parameter Polycrystalline CVD Diamond Single Crystal CVD Diamond
Growth Method MPCVD MPCVD
Thermal Conductivity ≥1000 / ≥1500 / >1800 W/(m·K) @293 K ≥1600 / ≥1800 / ≥2000 / ≥2200 W/(m·K) @293 K

High-end reference: 2400–2600 W/(m·K)
Thermal Diffusivity >5.5 / ≥8.3 / ≥10.0 cm²/s @300 K ≥10 / ≥11 / ≥12 cm²/s @300 K
Thermal Expansion 1.0 ± 0.1 ppm/K @300 K 1.0 ± 0.1 ppm/K @300 K
Volume Resistivity ≥1×10¹² Ω·cm ≥1×10¹³ Ω·cm
Thickness Range 0.10–1.00 mm 0.05–5.50 mm
Thickness Tolerance ±0.025 mm / ±0.05 mm ±0.025 mm / ±0.05 mm
Precision parts: ±0.015 mm
Available Size Large-size mass production; up to 8 inches Mainstream 10×10 mm; high-end customization up to 20×20 mm
Polished Surface Roughness Ra ≤20 / 50 nm Ra ≤5 / 10 / 20 nm
Ultra-precision: 0.5–1 nm
Lapped Surface Roughness Ra ≤200 / 250 nm Ra ≤200 nm
Flatness ≤1 μm over 10 mm ≤1 μm over 10 mm
Precision polished reference: 0.5 μm / 10 mm
Dimensional Tolerance ±0.05 mm or +0.20 / -0 mm ±0.05 mm or +0.20 / -0 mm
Metallization Ti/Pt/Au, Ti/Au, W, Mo Ti/Pt/Au, Ti/Au, TiW/Au, W, Mo
Quality Documentation CoA available; third-party testing available CoA available; third-party testing supported

Reference values are based on standard room-temperature mass-production parameters. Final heat spreader specifications depend on selected material grade and project requirements.

Applications

Thermal Management for Demanding Electronic Systems

01

High-End Chips

High thermal conductivity material for demanding chip thermal-management projects.

02

Laser Devices

Diamond material options for applications requiring strong thermal performance.

03

High-Frequency Equipment

High thermal conductivity and electrical resistivity for demanding environments.

04

Large-Area Thermal Spreading

Polycrystalline material supports larger available sizes for large-area requirements.

Processing Options

Surface Finish, Geometry & Metallization

01

Surface Finish

Polished and lapped surface conditions are available according to selected material and project requirements.

02

Dimensions & Tolerance

Dimensions, thickness and tolerances are reviewed according to material type and drawing requirements.

03

Metallization

Options include Ti/Pt/Au, Ti/Au, W and Mo, with TiW/Au also available for single crystal material.

Technical Review

What to Send for a Heat Spreader Review

Material selection should be based on the complete project requirement rather than thermal conductivity alone.

✓
Application Tell us where the diamond heat spreader will be used.
✓
Dimensions & Thickness Provide target size, thickness and tolerance.
✓
Thermal Requirement Specify target conductivity or performance requirement.
✓
Surface Condition Specify polished, lapped or precision requirements.
✓
Metallization & Drawing Upload drawing and interface requirements.

Project Review Process

01

Submit Application

Provide application, dimensions, quantity and drawing.

02

Material Selection

Review single crystal versus polycrystalline requirements.

03

Specification Review

Confirm dimensions, surface, metallization and quality requirements.

04

Quotation

Quotation follows confirmed technical specifications.

Submit Your Drawing
Quality Documentation

Documentation & Testing Support

CoA Documentation

Certificate of Analysis and project-specific documentation can be provided according to confirmed requirements.

Testing Support

Third-party testing can support Raman, thermal performance, flatness, surface roughness and electrical resistivity requirements.

FAQ

CVD Diamond Heat Spreader Questions

What thermal conductivity is available?

Polycrystalline reference grades are ≥1000, ≥1500 and >1800 W/(m·K) at 293 K. Single crystal grades are ≥1600, ≥1800, ≥2000 and ≥2200 W/(m·K), with high-end reference values of 2400–2600 W/(m·K).

Should I choose single crystal or polycrystalline?

Single crystal provides higher thermal performance, higher electrical resistivity and better precision surface capability. Polycrystalline material provides larger available sizes.

What thickness ranges are available?

Polycrystalline material has a reference thickness range of 0.10–1.00 mm. Single crystal material has a reference range of 0.05–5.50 mm.

Can the surface be polished?

Yes. Polycrystalline polished surface reference roughness is Ra ≤20 / 50 nm. Single crystal reference values are Ra ≤5 / 10 / 20 nm, with ultra-precision reference values of 0.5–1 nm.

Is metallization available?

Yes. Reference options include Ti/Pt/Au, Ti/Au, W and Mo. TiW/Au is also listed for single crystal material.

Technical Review

Have a CVD Diamond Heat Spreader Requirement?

Send your application, material requirement, dimensions, thickness, thermal target, surface requirement and drawing for technical review.