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Single Crystal CVD Diamond

Single Crystal CVD Diamond for High-Performance Thermal & Precision Applications

Free-standing single crystal CVD diamond produced by MPCVD, supporting high thermal conductivity, high electrical resistivity, precision surface finishing and application-specific dimensions.

Reference values shown on this page are based on standard room-temperature mass-production parameters. Final dimensions, surface condition and performance requirements are confirmed during technical review and quotation.
Material Overview

Free-Standing Single Crystal CVD Diamond

Single crystal CVD diamond combines a continuous crystal lattice without grain boundaries with high thermal conductivity, high electrical resistivity and the ability to achieve precision polished surfaces.

01

MPCVD Growth

Microwave plasma chemical vapor deposition for free-standing single crystal material.

02

High Thermal Performance

Multiple thermal conductivity grades are available for thermal-management projects.

03

Precision Surface Finish

Polished, lapped and ultra-precision finishing options according to project need.

04

Custom Geometry

Thickness, dimensions and project geometry reviewed according to drawings and use case.

Single crystal CVD diamond material
Single Crystal CVD Diamond Product illustration for material and application reference.
Technical Reference

Core Single Crystal Material Parameters

Reference values under standard room-temperature conditions. Project-specific requirements should be submitted for technical review.

Thermal Conductivity
≥1600–≥2200
W/(m·K) @ 293 K
High-end reference: 2400–2600 W/(m·K)
Thickness
0.05–5.50 mm
Supports ultra-thin and thick customized requirements.
Volume Resistivity
≥1×10¹³ Ω·cm
Intrinsic undoped reference value.
Mainstream Size
10 × 10 mm
High-end customization up to 20 × 20 mm according to project review.
Specifications

Single Crystal CVD Diamond Technical Reference

The following values are reference parameters for standard mass-production material and precision options.

Parameter Single Crystal CVD Diamond Project Notes
Material Type Free-standing Single Crystal CVD Diamond Material-grade selection based on application.
Growth Method MPCVD — Microwave Plasma Chemical Vapor Deposition Standard growth method.
Thermal Conductivity ≥1600 / ≥1800 / ≥2000 / ≥2200 W/(m·K) @ 293 K High-end reference can reach 2400–2600 W/(m·K).
Thermal Diffusivity ≥10.0 / ≥11.0 / ≥12.0 cm²/s @ 300 K Grade-dependent.
Coefficient of Thermal Expansion 1.0 ± 0.1 ppm/K @ 300 K Standard room-temperature reference.
Volume Resistivity ≥1×10¹³ Ω·cm Intrinsic undoped reference.
Thickness Range 0.05–5.50 mm Ultra-thin / thick customization supported.
Thickness Tolerance ±0.025 mm / ±0.05 mm Precision parts can reach ±0.015 mm.
Available Size Mainstream 10 × 10 mm; high-end customization up to 20 × 20 mm Final size subject to technical review.
Polished Surface Roughness Ra ≤5 / 10 / 20 nm Ultra-precision polish reference: 0.5–1 nm.
Lapped Surface Roughness Ra ≤200 nm Surface state selected according to application.
Flatness ≤1 μm over 10 mm Precision polished parts can be optimized to 0.5 μm / 10 mm.
Dimensional Tolerance ±0.05 mm or +0.20 / -0 mm Drawing-dependent.
Metallization Ti/Pt/Au, Ti/Au, TiW/Au, W, Mo Available according to bonding and integration requirements.
Quality Documentation CoA available; third-party testing supported Raman, thermal, flatness, roughness and resistivity testing can be reviewed according to project requirements.
Reference values are based on standard room-temperature conditions and general mass-production parameters. Final specifications are confirmed during project technical review.
Material Advantages

Why Single Crystal CVD Diamond?

01

High Thermal Conductivity

Single crystal diamond offers a continuous lattice without grain boundaries, supporting high-end thermal-management applications.

02

High Electrical Resistivity

Intrinsic undoped single crystal material provides high electrical resistivity for applications with insulation requirements.

03

Precision Polishing

Single crystal material supports lower surface roughness for optical, precision bonding and high-precision integration projects.

04

Custom Integration

Thickness, dimensions, metallization and surface conditions can be reviewed according to project specifications.

Applications

Designed for High-Performance Engineering Applications

Material grade and processing requirements should be selected according to thermal load, geometry, interface design and surface requirements.

01

High-Power Chips

High thermal conductivity material for demanding electronic thermal-management projects.

02

Laser & Photonics

Precision single crystal material for thermal and optical-related applications.

03

High-Frequency Devices

High thermal performance and electrical insulation for demanding device environments.

04

Precision Bonding

Ultra-precision polished surfaces and optional metallization for integration projects.

Standard & Custom

Submit Your Drawing for Technical Review

Instead of selecting material by one parameter alone, submit your complete application requirements so material grade, dimensions, surface condition and integration needs can be reviewed together.

✓
Dimensions & Thickness Provide target length, width, diameter, thickness and tolerance.
✓
Thermal Requirement Specify target thermal performance or device operating requirements.
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Surface Condition Polished, lapped or precision surface requirement.
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Metallization Provide bonding/interface requirements if metallization is needed.
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Drawing or Specification Upload drawings and supporting documents for technical review.

Project Review Process

01

Submit Requirements

Application, dimensions, quantity, drawing and technical requirements.

02

Technical Review

Review material grade, dimensions, surface requirements and integration needs.

03

Specification Confirmation

Confirm feasible specifications and inspection requirements.

04

Quotation

Commercial quotation follows confirmed technical requirements.

Request a Technical Review
Quality Documentation

Inspection & Documentation Support

Inspection items and documentation can be aligned with project requirements during technical review.

Quality Documentation

CoA documentation is available, with third-party testing support according to project requirements.

  • Certificate of Analysis (CoA)
  • Project-specific testing documentation
  • Third-party testing support

Reference Inspection Items

Relevant inspection requirements can be confirmed before quotation and production.

  • Raman spectroscopy
  • Thermal performance
  • Flatness
  • Surface roughness
  • Electrical resistivity
FAQ

Single Crystal CVD Diamond Questions

What thermal conductivity grades are available?

Reference grades include ≥1600, ≥1800, ≥2000 and ≥2200 W/(m·K) at 293 K. High-end material reference values can reach 2400–2600 W/(m·K). Final grade selection should be confirmed during technical review.

What thickness range is available?

The reference thickness range is 0.05–5.50 mm, supporting both ultra-thin and thicker customized requirements.

What surface finish can be provided?

Polished reference roughness includes Ra ≤5 / 10 / 20 nm, while ultra-precision polishing can reach approximately 0.5–1 nm. Lapped surface reference roughness is Ra ≤200 nm.

Can metallization be provided?

Reference metallization options include Ti/Pt/Au, Ti/Au, TiW/Au, W and Mo. The final structure should be reviewed according to bonding and integration needs.

Can I submit a custom drawing?

Yes. Submit your drawing, target dimensions, thickness, quantity, application, surface condition and performance requirements through the RFQ form for technical review.

Is quality documentation available?

CoA documentation is available and third-party testing can be supported. Inspection requirements should be confirmed as part of the project review.

Technical Review

Have a Single Crystal CVD Diamond Requirement?

Send your application, target dimensions, thickness, thermal requirements, surface condition and drawing. JingChuang CVD will review the project requirements before quotation.