CVD Diamond Thermal Management

CVD Diamond Heat Sinks

CVD diamond heat spreader materials for power electronics, semiconductor lasers, RF systems and advanced packaging. Standard grades and drawing-based dimensions are available for technical review.

  • Designed for demanding heat-spreading applications
  • Single-crystal and polycrystalline material options
  • Specifications reviewed against your application, dimensions and estimated quantity
Product Specifications

CVD diamond heat sink grades and dimensional options

Compare the available single-crystal and polycrystalline materials for CVD diamond heat sinks, including size, thickness and thermal-conductivity ranges.

Maximum Thermal Conductivity

>1,800 W/m·K

Available for single-crystal CVD diamond heat sinks.

Single-Crystal Size

1–20 mm

Available length and width range.

Single-Crystal Thickness

0.3–5 mm

Thickness options are subject to specification review.

Polycrystalline Diameter

2–6 inch

Available polycrystalline wafer diameter range.

Comparison of single-crystal and polycrystalline CVD diamond heat sink specifications
Product Type Size Range Thickness Thermal Conductivity Available Shapes
CVD Single-Crystal Diamond Heat Sink High Thermal Grade 1–20 mm
Length / width
0.3–5 mm >1,800 W/m·K Rectangular, circular and custom geometries
CVD Polycrystalline Diamond Heat Sink Large-Area Material 2–6 inch
Diameter
0.3–0.5 mm 800–1,800 W/m·K Wafers, square plates and custom laser-cut shapes

Specifications vary by material grade, dimensions, thickness and product configuration. Final values must be confirmed during technical review.

Application Areas

CVD Diamond Heat Sink Applications

CVD diamond heat spreaders can be evaluated for thermal management in power electronics, semiconductor lasers, advanced packaging and RF systems. Final material selection depends on operating conditions, dimensions and integration requirements.

Application 01

Power Electronics

CVD diamond heat spreaders may be evaluated for thermal management near high-power transistors, rectifiers and IGBT modules. Operating temperature, mounting method and interface conditions should be reviewed before material selection.

  • Power Transistors
  • Rectifiers
  • IGBT Modules
Application 02

Semiconductor Laser Systems

Diamond heat-spreading materials may be considered for thermal paths in semiconductor laser assemblies. Required dimensions, surface condition and integration method should be included in the technical review.

  • Laser Diodes
  • Laser Modules
  • Thermal Interfaces
Application 03

GaN and SiC Device Packaging

CVD diamond materials may be reviewed for thermal management in wide-bandgap semiconductor packaging. Device layout, heat load, electrical isolation and attachment requirements should be evaluated as part of the application.

  • GaN Devices
  • SiC Devices
  • Advanced Packaging
Application 04

RF and High-Reliability Electronics

Diamond heat spreaders may be evaluated for RF and other high-reliability electronic assemblies. Thermal load, frequency, component layout and dimensional tolerances should be supplied for engineering review.

  • RF Systems
  • Communications
  • Electronic Modules

Need help evaluating a CVD diamond heat sink application? Prepare your operating conditions, dimensions, estimated quantity and available drawings for technical review.

Request an Application Review

WHY CVD DIAMOND

Why CVD Diamond for Thermal Management?

CVD diamond combines high thermal conductivity, electrical insulation and low thermal expansion for heat-spreading components used in demanding electronic, laser and semiconductor systems.

High Thermal Conductivity

Available single-crystal CVD diamond grades can provide thermal conductivity above 1,800 W/m·K, supporting heat transfer in compact, high-power assemblies.

>1,800 W/m·K Available single-crystal grades

Electrical Insulation

Diamond transfers heat while remaining electrically insulating, making it suitable for applications where thermal and electrical requirements must be managed together.

Thermal + Electrical Combined application requirements

Low Thermal Expansion

Low thermal expansion can support dimensional stability across repeated heating and cooling cycles in precision electronic and optical assemblies.

Dimensional Stability For repeated thermal cycles
CVD DIAMOND MATERIAL OPTIONS

Single-crystal and polycrystalline CVD diamond options.

Review the available material formats and specification ranges below. Final dimensions, thickness, thermal performance and configuration are confirmed through technical review.

SINGLE-CRYSTAL MATERIAL

Single-Crystal CVD Diamond

Single-crystal CVD diamond material for thermal-management applications requiring compact dimensions and high heat-spreading performance.

Length / width
1–20 mm
Thickness
0.3–5 mm
Thermal conductivity
>1,800 W/m·K
Available shapes
Rectangular, circular and custom
WAFER AND PLATE FORMATS

Polycrystalline CVD Diamond

Polycrystalline CVD diamond material available in wafer, plate and custom-cut formats for larger-area thermal-management applications.

Diameter
2–6 inch
Thickness
0.3–0.5 mm
Thermal conductivity
800–1,800 W/m·K
Available formats
Wafer, square plate and custom cut

Specification ranges vary by material grade and configuration. Final values are subject to technical review.

TECHNICAL REVIEW PROCESS

From application requirements to a confirmed project scope.

This four-step workflow helps align the application, material options, dimensions, quantity and drawings before an order proceeds.

01

Requirement Review

Review the application, operating conditions, dimensions, quantity and available drawings.

  • Application and operating conditions
  • Dimensions, quantity and drawings
02

Material & Specification Alignment

Compare applicable single-crystal or polycrystalline CVD diamond options against the submitted requirements.

  • Material and grade options
  • Standard or drawing-based format
03

Quotation & Order Confirmation

Confirm the proposed specification, project scope and commercial requirements before production.

  • Proposed specification and scope
  • Quantity and order requirements
04

Production & Delivery Coordination

Coordinate production and shipment according to the confirmed order requirements.

  • Confirmed order requirements
  • Packaging and shipment coordination
PREPARE FOR TECHNICAL REVIEW Application details, dimensions, estimated quantity and available drawings help us review your requirements.
Request a Technical Review
FREQUENTLY ASKED QUESTIONS

CVD diamond heat sink questions

Review common technical and purchasing questions about CVD diamond grades, dimensions, custom specifications, prototype quantities and quotation requirements.

How do single-crystal and polycrystalline CVD diamond differ?

Single-crystal CVD diamond is generally selected for compact components requiring high material uniformity and thermal performance. Polycrystalline CVD diamond is available in larger plate and wafer formats for applications requiring a wider heat-spreading area. Material selection should be based on the required dimensions, thermal target and integration method.

What thermal conductivity grades are available?

Available thermal conductivity depends on whether the application uses single-crystal or polycrystalline CVD diamond, as well as the selected material grade and product configuration. Provide your target thermal performance so the appropriate option can be reviewed.

What sizes, thicknesses and shapes are available?

The available size and thickness range depends on the CVD diamond material type and grade. Rectangular, circular, plate, wafer and drawing-based shapes may be reviewed. Submit the required length, width, thickness, tolerance and quantity for confirmation.

Can you supply CVD diamond to a custom drawing?

Drawing-based requirements can be reviewed for dimensions, thickness, tolerances, shape, surface condition and quantity. Upload a PDF, CAD export or specification document with your technical inquiry. Final feasibility is confirmed during the technical review.

Can I request samples or prototype quantities?

Sample and prototype requests can be reviewed according to the selected material grade, dimensions and quantity. Include the intended application and expected production requirement so availability can be evaluated.

What information should I provide for a technical review and quotation?

Provide the application, operating conditions, preferred material type, required dimensions, thickness, tolerances, thermal target, estimated quantity and any available drawings. Complete information helps the technical team evaluate the requirement and prepare an appropriate quotation.

TECHNICAL RFQ

Request a CVD diamond technical review.

Share your application, target performance, dimensions, estimated quantity and available drawings. Our team will review the information before preparing a technical response.

01

Application

Describe where the CVD diamond heat sink will be used and the relevant operating conditions.

02

Specifications

Provide dimensions, thickness, tolerances, thermal targets and any available drawings.

03

Quantity

Indicate whether you require prototypes, samples or an estimated production quantity.

PROJECT DETAILS

Submit your heat sink requirements

Fields marked with * are required. Upload drawings or specifications when available.

Request a Material Review